RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

0.95 BSC

MIN

E

MAX

Contact Pad Length (X5)

Contact Pad Width (X5)

Y1

X1

1.05

0.60

NOM

SILK SCREEN

12

5

C

E

X1

Y1

G

C

Contact Pad Spacing

2.60

Contact Pad to Center Pad (X2)

G

0.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-23344 Rev B

5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]

Atmel Legacy Global Package Code TSZ

AT24CSW01X/AT24CSW02X

Packaging Information

and its subsidiaries

Datasheet

DS20006396B-page 34