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AT24CSW04X 데이터시트(PDF) 35 Page - Microchip Technology |
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AT24CSW04X 데이터시트(HTML) 35 Page - Microchip Technology |
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35 / 43 page ![]() For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: (c) L L1 θ VIEW A-A SHEET 1 protrusions shall not exceed 0.25mm per side. 1. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. Foot Angle Number of Leads Pitch Outside lead pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Lead Thickness Lead Width Notes: L1 θ b c Dimension Limits E E1 D L e1 A A2 A1 Units N e 0° 0.08 0.30 - - - 8° 0.20 0.50 MILLIMETERS 0.95 BSC 1.90 BSC 0.30 - 0.70 - 0.60 REF 2.90 BSC - 2.80 BSC 1.60 BSC 0.90 - - MIN 5 NOM 1.10 1.00 0.10 0.60 MAX REF: Reference Dimension, usually without tolerance, for information purposes only. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M © 2018 Microchip Technology Inc. Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2 5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT] Atmel Legacy Global Package Code TSZ AT24CSW04X/AT24CSW08X Packaging Information © 2020-2021 Microchip Technology Inc. and its subsidiaries Datasheet DS20006426B-page 35 |
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