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AT25SF641 데이터시트(PDF) 72 Page - Dialog Semiconductor |
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AT25SF641 데이터시트(HTML) 72 Page - Dialog Semiconductor |
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72 / 76 page ![]() 71 AT25SF641 DS-25SF641–111E–3/2018 9. Ordering Information 9.1 Ordering Code Detail A T 2 5 S 6 4 S B U T 1 – – F Designator Product Family Device Density 641 = 64-megabit Package Option M = 8-pad, 5 x 6 x 0.75 mm DFN S = 8-lead, 0.208" wide SOIC CC = 1 mm pitch BGA U = 0.5mm pitch dBGA DWF = Die in Wafer Form Device Grade U = Green, Matte Sn or Sn alloy, Industrial temperature range (–40°C to +85°C) Shipping Carrier Option T = Tape and reel Operating Voltage B = 2.7V to 3.6V A Device Revision Ordering Code (1) Package Lead Finish Operating Voltage Max. Freq. (MHz) Operation Range AT25SF641-MHB-T 8MA1 SnAgCu 2.7V-3.6V 104 MHz -40 ℃ to 85℃ (Industrial Temperature Range) AT25SF641-SUB-T 8S4 AT25SF641-DWF (2) DWF 1. The shipping carrier option code is not marked on the devices. 2. Contact Adesto for mechanical drawing or sales information. Package Type 8S4 8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC) 8MA1 8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra-Thin Dual Flat No-lead (UDFN) DWF Die in Wafer Form |
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