MAX9673

Maxim Integrated Products. All rights reserved.

Page 3

II. Manufacturing Information

A. Description/Function:

10-Bit, Programmable Gamma Reference Systems with MTP for TFT LCDs

B. Process:

S45

C. Number of Device Transistors:

4548

D. Fabrication Location:

USA

E. Assembly Location:

China, Taiwan and Thailand

F. Date of Initial Production:

July 25, 2009

III. Packaging Information

A. Package Type:

28-pin TQFN 5x5

B. Lead Frame:

Copper

C. Lead Finish:

100% matte Tin

D. Die Attach:

Conductive

E. Bondwire:

Au (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

#05-9000-3809

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity per

JEDEC standard J-STD-020-C

Level 1

J. Single Layer Theta Ja:

47°C/W

K. Single Layer Theta Jc:

2°C/W

L. Multi Layer Theta Ja:

29°C/W

M. Multi Layer Theta Jc:

2°C/W

IV. Die Information

A. Dimensions:

99 X 101 mils

B. Passivation:

C. Interconnect:

Al/0.5%Cu with Ti/TiN Barrier

D. Backside Metallization:

None

E. Minimum Metal Width:

Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)

F. Minimum Metal Spacing:

Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)

G. Bondpad Dimensions:

H. Isolation Dielectric:

I. Die Separation Method:

Wafer Saw