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ADP5360ACBZ-2-R7 데이터시트(PDF) 60 Page - Analog Devices |
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ADP5360ACBZ-2-R7 데이터시트(HTML) 60 Page - Analog Devices |
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60 / 60 page ![]() ADP5360 Data Sheet Rev. 0 | Page 60 of 60 OUTLINE DIMENSIONS A B C D E F 2.600 2.560 2.520 1 2 3 4 5 6 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL A1 IDENTIFIER 0.560 0.500 0.440 0.330 0.300 0.270 SIDE VIEW 0.230 0.200 0.170 0.300 0.200 0.170 COPLANARITY 0.04 2.00 REF 0.40 BSC SEATING PLANE Figure 63. 32-Ball Wafer Level Chip Scale Package [WLCSP] (CB-32-2) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADP5360ACBZ-1-R7 −40°C to +85°C 32-Ball Wafer Level Chip Scale Package [WLCSP] CB-32-2 ADP5360ACBZ-2-R7 −40°C to +85°C 32-Ball Wafer Level Chip Scale Package [WLCSP] CB-32-2 ADP5360CB-EVALZ Evaluation Board Assembled with ADP5360ACBZ-1-R7 1 Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). ©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20499-0-11/19(0) |
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