6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

48

V

–0.3

48

V

–48

0.3

V

Fault clamping voltage

–0.3

V

VSS – 0.3

0.3

V

Source input pin (Sx) voltage to GND

–65

65

V

–90

V

90

V

Drain pin (Dx) voltage

V

Logic input pin (DR) voltage(2)

GND –0.7

48

V

Logic output pin (FF) voltage(2)

GND –0.7

6

V

Logic input pin (DR) current(2)

–30

30

mA

Logic output pin (FF) current(2)

–10

10

mA

Source or drain continuous current (Sx or Dx)

mA

Storage temperature

–65

150

°C

Ambient temperature

–55

150

°C

Junction temperature

150

°C

Total power dissipation (QFN)

1600

mW

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Stresses have to be kept at or below both voltage and current ratings at all time.

(3)

(4)

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001, all pins(1)

±6000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC

JS-002, all pins(2)

±750

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TMUX7462F

SCDS394A – MARCH 2021 – REVISED OCTOBER 2021

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