IRFPG30 datasheet(8/11 Pages) VISHAY

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Package Information

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Vishay Siliconix

Revision: 19-Oct-2020

Document Number: 91360

For technical questions, contact: hvm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TO-247AC (High Voltage)

VERSION 1: FACILITY CODE = 9

Notes

(1) Package reference: JEDEC® TO247, variation AC

(2) All dimensions are in mm

(3) Slot required, notch may be rounded

(4) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the

outermost extremes of the plastic body

(5) Thermal pad contour optional with dimensions D1 and E1

(6) Lead finish uncontrolled in L1

(7) Ø P to have a maximum draft angle of 1.5° to the top of the part with a maximum hole diameter of 3.91 mm

(8) Dimension b2 and b4 does not include dambar protrusion. Allowable dambar protrusion shall be 0.1 mm total in excess of b2 and b4

dimension at maximum material condition

MILLIMETERS

DIM.

MIN.

MAX.

NOTES

DIM.

MIN.

MAX.

NOTES

4.83

5.21

16.25

16.85

2.29

2.55

0.56

0.76

1.50

2.49

15.50

15.87

1.12

1.33

13.46

14.16

1.12

1.28

4.52

5.49

1.91

2.39

5.44 BSC

1.91

2.34

14.90

15.40

2.87

3.22

6, 8

3.96

4.16

2.87

3.18

Ø P

3.56

3.65

0.55

0.69

Ø P1

7.19 ref.

0.55

0.65

5.31

5.69

20.40

20.70

5.54

5.74

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