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STM32F732IE 데이터시트(PDF) 209 Page - STMicroelectronics |
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STM32F732IE 데이터시트(HTML) 209 Page - STMicroelectronics |
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209 / 226 page ![]() DS11854 Rev 6 209/226 STM32F732xx STM32F733xx Package information 222 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b(3)(4) 0.170 0.220 0.270 0.0067 0.0087 0.0106 b1(4) 0.170 0.200 0.230 0.0067 0.0079 0.0091 c(4) 0.090 - 0.200 0.0035 - 0.0079 c1(4) 0.090 - 0.160 0.0035 - 0.063 D(5) 26.000 1.0236 D1(6)(7) 24.000 0.9449 E(5) 26.000 0.0197 E1(6)(7) 24.000 0.9449 e 0.500 0.1970 L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1(4) 1 0.0394 REF N(8) 176 θ 0° 3.5° 7° 0° 3.5° 7° θ1 0° - - 0° - - θ2 10° 12° 14° 10° 12° 14° θ3 10° 12° 14° 10° 12° 14° R1 0.080 - - 0.0031 - - R2 0.080 - 0.200 0.0031 - 0.0079 S 0.200 - - 0.0079 - - aaa(9) 0.200 0.0079 bbb(9) 0.200 0.0079 ccc(9) 0.080 0.0031 ddd(9) 0.080 0.0031 1. Values in inches are converted from mm and rounded to four decimal digits. 2. A1 is defined as the distance from the seating plane to the lowest point on the package body. 3. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages. 4. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 5. To be determined at seating datum plane C. 6. The Top package body size may be smaller than the bottom package size by as much as 0.15 mm. 7. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch. 8. “N” is the max number of terminal positions for the specified body size. 9. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994. Table 118. LQFP176 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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