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STM32F732IE 데이터시트(PDF) 213 Page - STMicroelectronics |
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STM32F732IE 데이터시트(HTML) 213 Page - STMicroelectronics |
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213 / 226 page ![]() DS11854 Rev 6 213/226 STM32F732xx STM32F733xx Package information 222 Figure 91. UFBGA144 recommended footprint ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 120. UFBGA144 recommended PCB design rules (0.50 mm pitch BGA) Dimension Recommended values Pitch 0.50 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 119. UFBGA144 mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0AS_FP_V1 Dpad Dsm |
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