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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32WB35CC 데이터시트(PDF) 177 Page - STMicroelectronics |
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STM32WB35CC 데이터시트(HTML) 177 Page - STMicroelectronics |
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177 / 193 page  DS11929 Rev 11 177/193 STM32WB55xx STM32WB35xx Package information 185 7.3 VFQFPN68 package information VFQFPN68 is a 8 x 8 mm, 0.4 mm pitch, very thin fine pitch quad flat package. Figure 44. VFQFPN68 package outline 1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed version. Very thin profile: 0.80 < A ≤ 1.00 mm. 2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body. Exact shape and size of this feature is optional. Table 104. VFQFPN68 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.80 0.90 1.00 0.0315 0.0354 0.0394 A1 0 0.02 0.05 0 0.0008 0.0020 A3 - 0.20 - - 0.0008 - b 0.15 0.20 0.25 0.0059 0.0079 0.0098 D 7.85 8.00 8.15 0.3091 0.3150 0.3209 D2 6.30 6.40 6.50 0.2480 0.2520 0.2559 C D E TOP VIEW PIN 1 IDENTIFIER LASER MARKING 68 67 1 2 (2X) 0.10 C D2 E2 68 67 2 1 PIN 1 ID C 0.30 X 45' e b BOTTOM VIEW L EXPOSED PAD AREA SIDE VIEW E SEATING PLANE ddd C A A1 A2 B029_VFQFPN68_ME_V1 |
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