SPC58EEX datasheet(124/154 Pages) STMICROELECTRONICS

124 / 154 page

Electrical characteristics

SPC58EEx, SPC58NEx

124/154

DS11646 Rev 4

Figure 48. TxD Signal propagation delays

3.18.4.3

RxD

Table 69. TxD output characteristics

Symbol

Characteristic(1),(2)

Value

Unit

Min

Max

dCCTxAsym

CC D

Asymmetry of sending CC at 25 pF load

(= dCCTxD50% − 100 ns)

–2.45

2.45

dCCTxDRISE25+dCCTxDFALL25 CC

D Sum of Rise and Fall time of TxD signal at the

output pin(3)

—9(4)

D—

9(5)

dCCTxD01

CC D

Sum of delay between Clk to Q of the last FF

and the final output buffer, rising edge

—25

dCCTxD10

CC D

Sum of delay between Clk to Q of the last FF

and the final output buffer, falling edge

—25

1. TxD pin load maximum 25 pF.

2. Pad configured as VERY STRONG.

3. Sum of transition time simulation is performed according to Electrical Physical Layer Specification 3.0.1 and the entire

temperature range of the device has been taken into account.

4. VDD_HV_IO = 5.0 V ± 10%, Transmission line Z = 50 ohms, tdelay = 1 ns, CL = 10 pF.

5. VDD_HV_IO = 3.3 V ± 10%, Transmission line Z = 50 ohms, tdelay = 0.6 ns, CL = 10 pF.

dCCTxD10

dCCTxD01

TxD

PE_Clk

* FlexRay Protocol Engine Clock

Table 70. RxD input characteristics

Symbol

Characteristic

Value

Unit

Min

Max

C_CCRxD

CC D Input capacitance on RxD pin

—

uCCLogic_1

CC D Threshold for detecting logic high

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