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STM32F107RB 데이터시트(PDF) 83 Page - STMicroelectronics |
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STM32F107RB 데이터시트(HTML) 83 Page - STMicroelectronics |
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83 / 108 page ![]() DocID15274 Rev 10 83/108 STM32F105xx, STM32F107xx Package information 107 Figure 41. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package recommended footprint Figure 40. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Typ Min Max A - - 1.700 - - 0.0669 A1 0.270 - - 0.0106 - - A2 - 0.300 - - 0.0118 - A4 - - 0.800 - - 0.0315 b 0.450 0.500 0.550 0.0177 0.0197 0.0217 D 9.850 10.000 10.150 0.3878 0.3937 0.3996 D1 - 7.200 - - 0.2835 - E 9.850 10.000 10.150 0.3878 0.3937 0.3996 E1 - 7.200 - - 0.2835 - e - 0.800 - - 0.0315 - F - 1.400 - - 0.0551 - ddd - - 0.120 - - 0.0047 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 Table 58. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.500 mm Dsm 0.570 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.500 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm |
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