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STA8100GA 데이터시트(PDF) 5 Page - STMicroelectronics

부품명 STA8100GA
상세설명  Teseo V family automotive multi-band multi-constellation GNSS precise engine receiver
PDF  42 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA8100GA 데이터시트(HTML) 5 Page - STMicroelectronics

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STA8100GA
Overview
33
1
Overview
STA8100GA is part of the Teseo V family.
STA8100GA is a multi-band multi-constellation positioning receiver IC able to manage all
the GNSS constellations such as GPS, Galileo, Glonass, BeiDou, NAVIC (former IRNSS)
and QZSS, in L1, L2, L5 and E6 frequency bands.
STA8100GA is able to receive GPS, Galileo plus Beidou on L1 and L5 bands
simultaneously without the need of an external RF front-end.
A dedicated interface allows receiving GNSS data from the external RF front-end
STA5635A in order to manage the other GNSS bands (L2, L5, E6 bands) simultaneously
with the L1 band signals, allowing also a triple frequency mode L1/L2/L5 or L1/L5/E6.
STA8100GA provides to the main host via serial interface the precise raw measurements of
all the visible GNSS satellites to let run any possible precise position algorithm. STA8100GA
provides also an autonomous precision positioning calculation to main host using all the
satellites constellations.
STA8100GA is compliant with ST Automotive Grade qualification which includes in addition
to AEC-Q100 requirements a set of production flow methodologies targeting zero defect per
million. STA8100GAD and STA8100GADS are offered with STMicroelectronics dead
reckoning firmware called TESEO-DRAW.
With the help of HSM, STA8100GAS supports a secure boot and secure firmware upgrade
procedures which allow only properly signed binaries to run on STA8100GAS. STA8100GA
is fulfilling high quality and service level requirements of the Automotive market, is the ideal
solution for in-dash navigation, smart antenna, car to car, V2X, OEM telematics, marine,
drone, lawnmower and many other applications requiring a precise position.
STA8100GA embeds separated LDOs to supply, the analog parts, the digital core and the
IO ring of the device facilitating requirements to external power supply.
The chip is manufactured in CMOS technology and housed in a LFBGA package 81 balls
8x8 mm body size 0.8 mm pitch.



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