L9788 datasheet(241/264 Pages) STMICROELECTRONICS

241 / 264 page

DS12308 Rev 4

241/264

L9788

Package information

263

Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash

or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size

dimensions including mold mismatch.

Details of pin 1 identifier are optional but must be located within the zone indicated.

All Dimensions are in millimeters.

No intrusion allowed inwards the leads.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall

not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.

Dambar cannot be located on the lower radius or the foot. Minimum space between

protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.

10. Exact shape of each corner is optional.

11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm

from the lead tip.

12. A1 is defined as the distance from the seating plane to the lowest point on the package

body.

13. Dimensions D2 and E2 show the maximum exposed metal area on the package

surface where the exposed pad is located (if present). It includes all metal protrusions

from exposed pad itself.

14. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of

exposed pad which is guaranteed to be free from resin flashes/bleeds, bordered by

internal edge of inner groove.

15. The optional exposed pad is generally coincident with the top or bottom side of the

package and not allowed to protrude beyond that surface.

16. “N” is the number of terminal positions for the specified body size.

L9788 데이터시트(PDF) 241 Page - STMicroelectronics