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STA350B 데이터시트(PDF) 86 Page - STMicroelectronics |
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STA350B 데이터시트(HTML) 86 Page - STMicroelectronics |
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86 / 94 page ![]() PowerSSO-36 slug-down package thermal characteristics (STA350BW) STA350B, STA350BW 86/94 DocID018572 Rev 7 9 PowerSSO-36 slug-down package thermal characteristics (STA350BW) Using a four-layer PCB the thermal resistance junction-to-ambient with 2 copper ground areas of 6 x 4 cm2 and with 24 via holes (see Figure 36) is 17 °C/W in natural air convection. The dissipated power within the device depends primarily on the supply voltage, load impedance and output modulation level. Thus, the maximum estimated dissipated power for the STA350BW is: Figure 36. Double-layer PCB with 2 copper ground areas and 24 via holes Figure 37 shows the power derating curve for the PowerSSO-36 slug-down package on PCBs with copper areas of 5 x 4 cm2 and 6 x 4 cm2. Figure 37. PowerSSO-36 power derating curve 2 x 40 W @ 8 Ω, 25.5 V Pd max ~ 8 W 2 x 17 W + 1 x 35 W @ 4 Ω, 8 Ω, 25 V Pd max < 7 W AM045200v1 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 Pd (W) Tamb ( °C) Copper Area 5x4 cm and 20 via holes STA350BW Power-SSO36 Copper Area 6x4 cm and 24 via holes Copper Area 5x4 cm and 20 via holes STA350BW Power-SSO36 Copper Area 6x4 cm and 24 via holes AM045201v1 |
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