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STM32H757AI 데이터시트(PDF) 10 Page - STMicroelectronics |
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STM32H757AI 데이터시트(HTML) 10 Page - STMicroelectronics |
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10 / 251 page ![]() List of tables STM32H757xI 10/251 DS12931 Rev 1 Table 133. WLCSP156 bump recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 Table 134. UFBGA169 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234 Table 135. LQFP176 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 Table 136. LQFP208 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 Table 137. TFBG240+25 ball package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Table 138. TFBGA240+25 recommended PCB design rules (0.8 mm pitch) . . . . . . . . . . . . . . . . . . . 246 Table 139. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247 Table 140. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 |
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