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STM32H757AI 데이터시트(PDF) 235 Page - STMicroelectronics |
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STM32H757AI 데이터시트(HTML) 235 Page - STMicroelectronics |
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235 / 251 page ![]() DS12931 Rev 1 235/251 STM32H757xI Package information 249 Device marking for UFBGA169 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 76. UFBGA169 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 134. UFBGA169 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. MSv61388V1 Revision code Ball A1 identifier Product identification(1) Date code ES32H757 AII6 WW Y R |
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