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STM32H757AI 데이터시트(PDF) 246 Page - STMicroelectronics |
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STM32H757AI 데이터시트(HTML) 246 Page - STMicroelectronics |
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246 / 251 page ![]() Package information STM32H757xI 246/251 DS12931 Rev 1 Device marking for TFBGA240+25 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 85. TFBGA240+25 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 138. TFBGA240+25 recommended PCB design rules (0.8 mm pitch) Dimension Recommended values Pitch 0.8 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm MSv61394V1 Revision code Ball A1identifier ES32H757XIH6U Y WW Product identification(1) Date code R |
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