| 전자부품 데이터시트 검색엔진 |
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M24M02-DR 데이터시트(PDF) 21 Page - STMicroelectronics |
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M24M02-DR 데이터시트(HTML) 21 Page - STMicroelectronics |
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21 / 40 page ![]() Table 10. Cycling performance Symbol Parameter Test condition Max. Unit Ncycle Write cycle endurance(1) TA ≤ 25 °C, VCC(min) < VCC < VCC(max) 4,000,000 Write cycle(2) TA = 85 °C, VCC(min) < VCC < VCC(max) 1,200,000 1. The write cycle endurance is defined for group of four bytes located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3] where N is an integer. The write cycle endurance is defined by characterization and qualification. 2. A write cycle is executed when either a page write, a byte write, a write identification page or a lock identification page instruction is decoded. When using the byte write, the page write or the write identification page, refer also to Section 5.1.5 ECC (error correction code) and write cycling Table 11. Memory cell data retention Parameter Test condition Min. Unit Data retention(1) TA = 55 °C 200 Year 1. The data retention behavior is checked in production, while the 200-year limit is defined from characterization and qualification results. M24M02-DR M24M02-R DC and AC parameters DS7025 - Rev 11 page 21/40 |
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