M24M02-DR_V01 datasheet(34/40 Pages) STMICROELECTRONICS

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Revision history

Table 19. Document revision history

Date

Revision

Changes

22-Dec-2010

Initial release.

09-Feb-2011

Updated:

•

Section 3.18:Read Identification Page

•

Section 3.19: Read thelock status

•

Figure 2: SO8 connections

•

Table 6: Absolute maximum ratings

•

Table 10: Input parameters

•

Table 11: DCcharacteristics

•

Table 12: AC characteristics at 400 kHz

•

Table 13: 1 MHz AC characteristics

Deleted:

•

Table 15: Available M24M02-xproducts(package, voltage range, frequency, temperature

grade)

09-Aug-2011

Updated Figure 5: MaximumRbus value versusbusparasitic capacitance (Cbus) for an I2C bus at

maximum frequency fC = 1 MHz and Table 11: DCcharacteristics.

07-Feb-2012

Updated:

•

Table 2: Device select code

•

Table 3: Most significant address byte

•

Table 4: Leastsignificant address byte.

•

Section 3.6: Write operations

•

Section 3.8: Page Write

25-Oct-2012

Updated document template and text (minor changes).

Cycling updated to 4 million cycles and data retention updated to 200 years.

Added WLCSP packages.

04-Jun-2013

Document reformatted.

Removed information related to thin WLCSP package. Updated:

•

WLCSP package silhouette on cover page

•

Section 1: Description

•

Figure 25: WLCSP connections

•

Note (1) under Table 14: Absolute maximum ratings.

Added Figure 57: WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package

recommended footprint

23-May-2014

removed note on page 7, Updated Table 5: Device select code, updated section numbering for

Section 5.2.4 and Section 5.2.6, updated note 1 on Table 30: Memory cell data retention, updated

Figure 57: WLCSP- 8-bump, 3.556 x2.011 mm, wafer level chip scale package recommended

footprint.

27-Jul-2015

Updated:

•

Figure 3 with note 1.

•

Table 2

•

Section 9.1: SO8N package information and Section 9.2: WLCSP package information

02-Mar-2017

Updated:

•

Figure 18: WLCSP-8-bump, 3.556 x 2.011 mm, wafer levelchip scale package recommended

footprint

Added:

•

Unsawn wafer on cover page

•

Table 18: Ordering information scheme (unsawn wafer)

M24M02-DR M24M02-R

DS7025 - Rev 11

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