| 전자부품 데이터시트 검색엔진 |
|
STE2004DIE2 데이터시트(PDF) 65 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STE2004DIE2 데이터시트(HTML) 65 Page - STMicroelectronics |
|
65 / 66 page ![]() 65/66 STE2004 Figure 76. Alignment marks dimensions Table 30. Bumps Table 31. Die Mechanical Dimensions 94 µm 39 µm Bump Number Dimensions Bumps Size 30 µm X 98 µm X 17.5 Pad Size 43 µm X 107µm Pad Pitch 50 µm Spacing between Bumps 20 µm Die Size (X x Y) 6.42mm x 1.46mm Wafers Thickness 500 µm Table 32. Revision History Date Revision Description of Changes May 2004 3 Moved the value of FSCLK parameter from Min. to Max. on the page 60/ 66. July 2004 4 Inserted Table 24 -N-Line Inversion in the page 44/66 |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |