HC705JB2GRSSLASHH datasheet(125/128 Pages) NXP

125 / 128 page

August 28, 1998

GENERAL RELEASE SPECIFICATION

MECHANICAL SPECIFICATIONS

REV 1.1

14-1

SECTION 14

MECHANICAL SPECIFICATIONS

This section provides the mechanical dimensions for the two available packages

for MC68HC705JB2: the 20-Pin PDIP and 20-Pin SOIC.

14.1

20-PIN PLASTIC DUAL-IN-LINE PACKAGE (PDIP)

Figure 14-1. 20-Pin PDIP Mechanical Dimensions

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

J 20 PL

0.25 (0.010)

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

25.66

27.17

1.010

1.070

6.10

6.60

0.240

0.260

3.81

4.57

0.150

0.180

0.39

0.55

0.015

0.022

2.54 BSC

0.100 BSC

0.21

0.38

0.008

0.015

2.80

3.55

0.110

0.140

7.62 BSC

0.300 BSC

0.51

1.01

0.020

0.040

1.27

1.77

0.050

0.070

–A–

SEATING

PLANE

D 20 PL

–T–

0.25 (0.010)

1.27 BSC

0.050 BSC

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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