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STV8162D 데이터시트(PDF) 8 Page - STMicroelectronics

부품명 STV8162D
상세설명  5 V, 5 V and 8 V Triple-Voltage Regulator with Disable and Reset Functions
PDF  12 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STV8162D 데이터시트(HTML) 8 Page - STMicroelectronics

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Power Dissipation and Layout Indications
STV8162 - STV8162D
8/12
5
Power Dissipation and Layout Indications
The power is mainly dissipated by the three device buffers. It can be calculated by the equation:
P = (VIN1-VOUT1) x IOUT1 + (VIN2-VOUT2) x IOUT2 + (VIN3-VOUT3) x IOUT3
The following table lists the different RthJA values of these packages with or without a heat sink and
the corresponding maximum power dissipation assuming:
●
Maximum Ambient Temperature = 70° C
●
Maximum Junction Temperature = 140° C
Device
Heat Sink
RthJA in °C/W
PMAX in W
STV8162
No
50
1.4
Yes
15
4.6
STV8162D
No
56 to 40
1.25 to 1.75
Yes
32
2.2
Figure 7: Thermal Resistance (Junction-to-Ambient) of DIP18 Package without Heat Sink
Figure 8: Metal plate mounted near the STV8162D for heat sinking
Copper area (cm²) (35 µm plus solder) Board is face-down
To optimize the thermal conductivity of the copper
layer and the exchanges with the air, the solder
must cover the maximum amount of this area.
60
40
50
10
12
0
55
45
24
8
6
Test Board with
“On Board” square heat sink area.
Top View
Bottom View



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