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C5NPARCH-RM/D 데이터시트(PDF) 106 Page - NXP Semiconductors |
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C5NPARCH-RM/D 데이터시트(HTML) 106 Page - NXP Semiconductors |
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106 / 114 page ![]() 106 CHAPTER 4: MECHANICAL SPECIFICATIONS C Package Measurements Table 61 defines the C-5e NP package measurements, providing nominal, minimum, and maximum sizes where appropriate. At Motorola’s discretion up to fourteen (14) capacitors may or may not be attached on the top of the package. Marking Codes Table 62 explains the marking on the C-5e NP. Table 61 Package Measurements (Reference Figure 28, Figure 29 and Figure 30 for Symbols) SYMBOL DEFINITION NOM. (MM) MIN. (MM) MAX. (MM) A Overall 3.26 2.97 3.55 A1 Ball height 0.70 0.6 0.8 A 2 C4 and Die 0.86 0.82 0.9 A 3 Body thickness 1.7 1.55 1.85 A4 Capacitor pads 0.6 D Body size 31.00 30.80 31.20 D 1 Ball footprint (X) 28.00 E Body size 31.00 30.80 31.20 E 1 Ball footprint (Y) 28.00 e Ball pitch 1.00 b Ball diameter 0.70 Table 62 C-5e Network Processor Marking Codes MARKING (EXPLANATION OF CODES) Top Logo/Part#/Date Code Bottom N/A Pin 1 Marking Chamfered Corner Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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