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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32U595AI 데이터시트(PDF) 360 Page - STMicroelectronics |
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STM32U595AI 데이터시트(HTML) 360 Page - STMicroelectronics |
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360 / 377 page  Package information STM32U59xxx 360/377 DS13633 Rev 1 6.5 WLCSP150 package information This WLCSP is a 150-ball, 5.38 x 5.47 mm, 0.4 mm pitch, wafer level chip scale array package. Figure 97. WLCSP150 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The axis perpendicular to datum Z of each ball must lie within this tolerance zone. A1 BALL LOCATION F G e1 e e e1 E BOTTOM VIEW A3 A2 FRONT VIEW b X E A1 ORIENTATION REFERENCE aaa D A2 A DETAIL A A1 bbb Z SIDE VIEW A1 b (150) Z eee ccc ddd ZX Y Z DETAIL A ROTATED 90 Z BUMP B0DX_WLCSP150_ME_V1 |
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