10

Reflow profile

Figure 30. ST ECOPACK® recommended soldering reflow profile for PCB mounting

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6 °C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

Note:

Maximum soldering profile corresponds to the latest IPC/JEDEC J-ST-020.

CLT03-2Q3, CLT03-1SC3

Reflow profile

DS12302 - Rev 13

page 21/24