P9027LP-R Datasheet

© 2016 Integrated Device Technology, Inc

2

April 28, 2016

Absolute Maximum Ratings

Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is

not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Table 1. Thermal Information 1,2

Pins

Rating

Units

RECT, OUT, OUTSNS

-0.3 to 9.0

V

LX1, LX2

-0.8 to 9.0

V

PGND, AGND

-0.3 to 0.3

V

VDD, CFLY1, CFLY2, SDA, SCL,

EN

̅̅̅̅, ACT

̅̅̅̅̅̅, IOC, VSET, VHDR, INT

̅̅̅̅̅, EOC, TS1, TS2,

-0.3 to 6.0

V

Maximum input current into SFBR

3.0

A

All voltages here are measured with respect to analog ground pin (AGND).

Table 2. Thermal Symbol Information 1,2

Symbol

Description

Rating

Units

JA

Thermal Resistance (WLCSP-40)

71

C/W

JC

Thermal Resistance Junction to Case

18

C/W

TA

Ambient Operating Temperature Range

0 to 85

C

TJ

Junction Operating Temperature Range

0 to 125

C

TJs

Junction Storage Temperature Range

-55 to 150

C

TLEAD

Maximum Soldering Temperature (at Leads)

300

C

Notes:

1. The maximum power dissipation is PD(MAX) = (TJ(MAX)-TA)/θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power

dissipation will result in excessive die temperature, and the device will enter thermal shutdown.

2. The thermal rating was calculated based on a JEDEC 51 standard 4-layer board, 6 vias with dimensions 4 in × 4.5 in still air

conditions. Actual thermal resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow,

altitude, and other unlisted variables.

Table 3. ESD Information

Test Model

Pins

Rating

Units

HBM

All

2,000

V

CDM

All

500

V