P9242-R3/RB Datasheet

© 2019 Integrated Device Technology, Inc.

8

May 17, 2019

3. Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses beyond those listed under “Absolute Maximum Ratings” might cause permanent

damage to the P9242-R3. Functional operation of the P9242-R3 at absolute maximum ratings is not implied. Exposure to absolute maximum

rating conditions for extended periods could affect long-term reliability.

Table 2.

Absolute Maximum Ratings

Pins[a]

Rating[b]

Units

EN

����,VIN,SW_S,VBRG_IN,SW_BRG1,SW_BRG2,CSP,CSN,BST_BRG1,BST_BRG2,GH_BRG1,

GH_BRG2

-0.3 to 28

V

PREG, LDO33, VIN_LDO, LED1, LED2, VDDIO, SCL, SDA, ILIM/FOD, LED/Q-Fact, VCOIL, TS, LOAD,

OVP_CTL, D-, D+, Q_DRV1, Q_DRV2, GL_BRG1, GL_BRG2, VDEM1, IDEMI, ISNS_OUT, DRV_VIN, INT

���� -0.3to6 V

LDO18

-0.3 to 2

V

[a] Absolute maximum ratings are not provided for reserved pins (RSV). These pins are not used in the application.

[b] All voltages are referred to ground unless otherwise noted. All GND pins and the exposed pad (EP) are connected together.

Table 3.

Package Thermal Information

Symbol

Description

VFQFPN Rating

Units

θJA

Thermal Resistance Junction to Ambient[a], [b], [c]

27.2

°

C/W

θJC

Thermal Resistance Junction to Case [b], [c]

18.8

°

C/W

θJB

Thermal Resistance Junction to Board[b], [c]

1.36

°

C/W

TJ

Operating Junction Temperature[a], [b]

-40 to +125

°

C

TAMB

Ambient Operating Temperature[a], [b]

-40 to +85

°

C

TSTG

Storage Temperature

-55 to +150

°

C

TLEAD

Lead Temperature (soldering, 10s)

+300

°

C

[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TAMB) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation

will result in excessive die temperature, and the device will enter thermal shutdown.

[b] This thermal rating was calculated on a JEDEC 51-standard 4-layer board with the dimensions 76.2 x 114.3 mm in still air conditions.

[c] Actual thermal resistance is affected by the PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted

variables.

Table 4.

ESD Information

Test Model

Pins

Ratings

Units

HBM

All pins

±2000

V

CDM

All pins

±500

V