Package Outline and Connection Diagrams

20186811

Top View - Bump Underneath

24 Bump micro SMD Package

See NSC Package Number TME24AAA

20186812

Note: The actual physical placement of the package marking will vary from part

to part. The package marking “XY” will designate the date code. The “TT” is a

NSC internal code for die traceability; engineering sample parts will be marked

as "ES". Both will vary considerably. The pin 1 marking identifier is the location

of corner bump A1.

Top View - TME24 Device Marking

Ordering Information

For 24 Bump micro SMD Package

Output Voltage Grade

LP3929 Supplied As 250 Units, Tape & Reel LP3929 Supplied As 3000 Units, Tape & Reel

2.85 V

STD

LP3929TME-AACQ

LP3929TMEX-AACQ

Tape and Reel Information

20186810

Top View: Tape and Reel Information

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