L6730C - L6730D

Package mechanical data

47/50

Table 13.

HTSSOP20 mechanical data

DIM.

mm

inch

Min

Typ

Max

Min

Typ

Max

A

1.200

0.047

A1

0.150

0.006

A2

0.800

1.000

1.050

0.031

0.039

0.041

b

0.190

0.300

0.007

0.012

c

0.090

0.200

0.003

0.008

D

(1)

1.

Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15mm per side.

6.400

6.500

6.600

0.252

0.256

0.260

2.200

0.087

E

6.200

6.400

6.600

0.244

0.252

0.260

E1

(2)

2.

Dimension “E1” does not include interlead flash or protrusions. Intelead flash or protrusions shall not exceed 0.25mm per

side.

4.300

4.400

4.500

0.170

0.173

0.177

E2

(3)

3.

The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1” and “E2”

dimensions for each device application.

1.500

0.059

e

0.650

0.025

L

0.450

0.600

0.750

0.018

0.024

0.030

L1

1.000

0.039

k

0° min., 8° max.

aaa

0.100

0.004

Figure 42. Package dimensions