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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PCF8531U/2 데이터시트(PDF) 36 Page - NXP Semiconductors |
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PCF8531U/2 데이터시트(HTML) 36 Page - NXP Semiconductors |
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36 / 44 page  2000 Feb 11 36 Philips Semiconductors Product specification 34 × 128 pixel matrix driver PCF8531 Table 11 Bonding pads Table 12 Alignment marks R11 243 +5553.6 −821.7 R9 244 +5623.6 −821.7 R7 245 +5693.6 −821.7 R5 246 +5763.6 −821.7 R3 247 +5833.6 −821.7 R1 248 +5903.6 −821.7 PAD SIZE UNIT Pad pitch min. 70 µm Pad size; Al 62 × 100 µm Bump dimensions 50 × 90 × 17.5 (±5) µm Wafer thickness (excluding bumps) 381 µm MARKS x y C1 −5402.0 +823.1 C2 +5292.4 +823.4 F +5890.3 +401.9 Circle 1 −5543.0 +798.4 Circle 2 +5637.4 +798.4 SYMBOL PAD x y handbook, halfpage MGS487 x y 12.23 mm pitch 1.96 mm PCF8531 Fig.26 Bonding pads. handbook, full pagewidth MGS490 x center C y center 100 µm x center circle y center 100 µm 100 µm 100 µm x center F y center 80 µm Fig.27 Shapes of recognition pattern. |
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