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PCF8535 데이터시트(PDF) 47 Page - NXP Semiconductors |
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PCF8535 데이터시트(HTML) 47 Page - NXP Semiconductors |
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47 / 52 page ![]() 1999 Aug 24 47 Philips Semiconductors Objective specification 65 × 133 pixel matrix driver PCF8535 handbook, full pagewidth MGS693 R48 R64 T2 T1 T3 SCL SDA SDAOUT VSS1 VSS2 OSC VLCDIN VLCDOUT VLCDSENSE VDD1 VDD3 VDD2 SA0 SA1 T4 T5 x y 0, 0 R15 .. . C0 .. . R0 Dummy bump Alignment mark .. . RES R33 .. . C132 .. . R47 .. . .. . .. . R32 R16 PAD ONE .. . .. . Fig.27 Bonding pad location (viewed from bump side). The position of the bonding pads is not to scale. |
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