33989 datasheet(63/66 Pages) FREESCALE

부품명	33989

상세설명	System Basis Chip with High-Speed CAN Transceiver

PDF	66 Pages

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제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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63 / 66 page

Analog Integrated Circuit Device Data

Freescale Semiconductor

33989

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Figure 63. Thermal Test Board

Device on Thermal Test Board

RθJA is the thermal resistance between die junction and

ambient air.

MISO

SCLK

GND

CANL

CANH

MOSI

RST

INT

GND

V2CTRL

VSUP

HS1

VDD1

33989 Pin Connections

28-Pin SOICW

1.27 mm Pitch

18.0 mm x 7.5 mm Body

Material:

Single layer printed circuit board

FR4, 1.6 mm thickness

Cu traces, 0.07 mm thickness

Outline:

80 mm x 100 mm board area, including

edge connector for thermal testing

Area A:

Cu heat-spreading areas on board

surface

Ambient Conditions:

Natural convection, still air

Table 37. Thermal Resistance Performance

Thermal Resistance

Area A (mm2)

°C/W

RθJA

300

600

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