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MPC8260A 데이터시트(PDF) 46 Page - Freescale Semiconductor, Inc |
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MPC8260A 데이터시트(HTML) 46 Page - Freescale Semiconductor, Inc |
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46 / 52 page ![]() MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 46 Freescale Semiconductor Package Description Symbols used in Table 20 are described in Table 21. 5 Package Description The following sections provide the package parameters and mechanical dimensions for the MPC826xA. 5.1 Package Parameters Package parameters are provided in Table 22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA. Table 21. Symbol Legend Symbol Meaning OVERBAR Signals with overbars, such as TA, are active low. UTM Indicates that a signal is part of the UTOPIA master interface. UTS Indicates that a signal is part of the UTOPIA slave interface. UT8 Indicates that a signal is part of the 8-bit UTOPIA interface. UT16 Indicates that a signal is part of the 16-bit UTOPIA interface. MII Indicates that a signal is part of the media independent interface. Table 22. Package Parameters Parameter Value Package Outline 37.5 x 37.5 mm Interconnects 480 (29 x 29 ball array) Pitch 1.27 mm Nominal unmounted package height 1.55 mm |
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