STAC9752 datasheet(90/95 Pages) IDT

부품명	STAC9752

상세설명	TWO-CHANNEL, 20-BIT, AC??7 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING

PDF	95 Pages

Scroll/Zoom	100%

제조업체	IDT [Integrated Device Technology]

홈페이지	http://www.idt.com

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90 / 95 page

STAC9752/9753

TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING

IDT™

STAC9752/9753

REV 3.3 1206

TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING

15. SOLDER REFLOW PROFILE

15.1. Standard Reflow Profile Data

Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds.

FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid

State Surface Mount Devices” (www.jedec.org/download).

Figure 25. Reflow Profile

Profile Feature

Pb Free Assembly

Average Ramp-Up Rate (Tsmax - Tp)

3 oC / second max

Preheat

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin - tsmax)

150 oC

200

o C

60 - 180 seconds

Time maintained above

Temperature (TL)

Time (tL)

217

o C

60 - 150 seconds

Peak / Classification Temperature (Tp)

See “Package Classification Reflow Temperatures” on page 91.

Time within 5 oC of actual Peak Temperature (tp)

20 - 40 seconds

Ramp-Down rate

6 oC / second max

Time 25 oC to Peak Temperature

8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface.

STAC9752 데이터시트(PDF) 90 Page - Integrated Device Technology