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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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UCS1002-3 데이터시트(PDF) 108 Page - Microchip Technology |
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UCS1002-3 데이터시트(HTML) 108 Page - Microchip Technology |
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108 / 114 page  UCS1002-3 DS20006852A-page 108 2023 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 2.80 2.80 MILLIMETERS 0.50 BSC MIN E MAX 4.00 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.80 0.30 NOM 20-Lead Plastic Quad Flat, No Lead Package (G4) - 4x4 mm Body [QFN] SILK SCREEN 1 2 20 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 4.00 Contact Pad to Center Pad (X16) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Also called VQFN Microchip Technology Drawing C04-2126-G4 Rev D |
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