Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-903.425

1096.250

10

900.650

-994.626

2

-903.425

985.650

11

900.650

-316.774

3

-882.900

-650.050

12

901.625

1006.000

4

-882.900

-776.910

13

901.625

1116.600

5

-831.950

-886.910

14

697.050

1114.025

6

-831.950

-1025.350

15

586.450

1114.025

7

-177.390

-1045.600

16

-588.250

1114.025

8

-65.590

-1045.600

17

-698.850

1114.025

9

900.650

-1107.950

Pad Description

Pad Name

I/O

Internal

Connection

Function

PA0~PA7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port, wake-up by mask option

VSSA

¾¾

Negative power supply of DAC, ground

VSS

¾¾

Negative power supply, ground

VDD

¾¾

Positive power supply

VDDA

¾¾

DAC power supply

TEST

¾¾

No connection (open)

AUD

O

¾

Audio output for driving a external transistor or for driving HT82V733

RES

I

¾

Reset input, active low

OSC1

OSC2

I

O

¾

OSC1 and OSC2 are connected to an RC network or a crystal (by mask option)

for the internal system clock. In the case of RC operation, OSC2 is the output ter-

crystal, the two pins cannot be floating.

Absolute Maximum Ratings

Storage Temperature ..........................

-50°Cto125°C

Operating Temperature .......................

-40°Cto85°C*

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT36A4

Rev. 1.10

3

March 12, 2007