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MB96F348CSAPMC-GE2 데이터시트(PDF) 153 Page - fujitsu semiconductor |
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MB96F348CSAPMC-GE2 데이터시트(HTML) 153 Page - fujitsu semiconductor |
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153 / 159 page ![]() Preliminary Specification MB96300 FME/EMDC- 2007-02-12 MB96300_shortspec.fm 153 s PACKAGE DIMENSION MB96(F)34x QFP 100P 100-pin plastic QFP Lead pitch 0.65 mm Package width × package length 14.00 × 20.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 3.35 mm MAX Code (Reference) P-QFP100-14 ×20-0.65 100-pin plastic QFP (FPT-100P-M22) (FPT-100P-M06) (FPT-100P-M22) C 2002 FUJITSU LIMITED F100008S-c-5-5 1 30 31 50 51 80 81 100 20.00±0.20(.787±.008) 23.90±0.40(.941±.016) 14.00±0.20 (.551±.008) 17.90±0.40 (.705±.016) INDEX 0.65(.026) 0.32±0.05 (.013±.002) M 0.13(.005) "A" 0.17±0.06 (.007±.002) 0.10(.004) Details of "A" part (.035±.006) 0.88±0.15 (.031±.008) 0.80±0.20 0.25(.010) 3.00 +0.35 –0.20 +.014 –.008 .118 (Mounting height) 0.25±0.20 (.010±.008) (Stand off) 0~8˚ * * Dimensions in mm (inches). Note: The values in parentheses are reference values. |
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