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MB96F348CSAPMC-GE2 데이터시트(PDF) 154 Page - fujitsu semiconductor |
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MB96F348CSAPMC-GE2 데이터시트(HTML) 154 Page - fujitsu semiconductor |
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154 / 159 page ![]() MB96300 Series Preliminary Specification 154 FME/EMDC- 2007-02-12 MB96300_shortspec.fm s PACKAGE DIMENSION MB96(F)35x LQFP 64P - M23 64-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Code (Reference) P-LQFP64-12 ×12-0.65 64-pin plastic LQFP (FPT-64P-M23) (FPT-64P-M09) (FPT-64P-M23) C 2003 FUJITSU LIMITED F64018S-c-3-5 0.65(.026) 0.10(.004) 116 17 32 49 64 33 48 12.00±0.10(.472±.004)SQ 14.00±0.20(.551±.008)SQ INDEX 0.32±0.05 (.013±.002) M 0.13(.005) 0.145±0.055 (.0057±.0022) "A" .059 –.004 +.008 –0.10 +0.20 1.50 0~8˚ 0.25(.010) (Mounting height) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.10 (.004±.004) Details of "A" part (Stand off) 0.10(.004) * Dimensions in mm (inches). Note: The values in parentheses are reference values. |
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