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TDA7546 데이터시트(PDF) 66 Page - STMicroelectronics |
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TDA7546 데이터시트(HTML) 66 Page - STMicroelectronics |
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66 / 68 page ![]() Package information TDA7546 66/68 9 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 26. TQFP80LS mechanical data & package dimensions DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.60 0.063 A1 0.05 0.15 0.002 0.006 A2 1.35 1.40 1.45 0.053 0.055 0.057 B 0.22 0.32 0.38 0.009 0.013 0.015 C 0.09 0.20 0.003 0.008 D 16.00 0.630 D1 14.00 0.551 D3 12.35 0.295 e 0.65 0.0256 E 16.00 0.630 E1 14.00 0.551 E3 12.35 0.486 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.0393 K3.5 °(min.), 7°(max.) LQFP80 (14x14x1.40mm) A A2 A1 Seating Plane C 20 21 40 41 60 61 80 E3 D3 E1 E D1 D e 1 B TQFP80L 0.10mm .004 PIN 1 IDENTIFICATION K L L1 0.25mm Gage plane OUTLINE AND MECHANICAL DATA |
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