STA335BW datasheet(51/54 Pages) STMICROELECTRONICS

부품명	STA335BW

상세설명	2.1 channels high efficiency digital audio system

PDF	54 Pages

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제조업체	STMICROELECTRONICS [STMicroelectronics]

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51 / 54 page

STA335BW

Package thermal characteristics

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Package thermal characteristics

Using a double layer PCB the thermal resistance junction to ambient with 2 GND copper

area of 3x3 cm and with 16 via holes (see Figure 12) is 24 °C/W in natural air convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

The max estimated dissipated power for the STA335BW is:

Figure 12.

Double layer PCB Rth j-amb with 2 GND copper area and with 16 via holes

Figure 13 shows the Power Derating curve for the PSSO36 package with two copper areas

on board 2 x 2 cm and 3 x 3 cm.

Figure 13.

PSSO36 power derating curve

2 x 20 W @ 8

Ω, 18 V

Pd max ~ 4 W

2 x 10 W + 1 x 20 W @ 4

Ω, 8 Ω, 18 V

Pd max < 5 W

2 x 15 W @ 16

Ω, 24 V

Pd max ~ 3 W

100

120

140

160

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA335BW

PSSO36

Copper Area 3x3 cm

and via holes

STA335BW 데이터시트(PDF) 51 Page - STMicroelectronics