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CDCM1802 데이터시트(PDF) 2 Page - Texas Instruments

부품명 CDCM1802
상세설명  CDCM1802 Clock Buffer With Programmable Divider, LVPECL I/O Additional LVCMOS Output
PDF  30 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

CDCM1802 데이터시트(HTML) 2 Page - Texas Instruments

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CDCM1802
SCAS759C – APRIL 2004 – REVISED JULY 2017
www.ti.com
Product Folder Links: CDCM1802
Submit Documentation Feedback
Copyright © 2004–2017, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings ............................................................ 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 5
6.6
Switching Characteristics .......................................... 6
6.7
Jitter Characteristics.................................................. 6
6.8
Supply Current Electrical Characteristics ................. 6
6.9
Control Input Characteristics..................................... 7
6.10
Timing Requirements ............................................. 7
6.11
Bias Voltage VBB.................................................... 7
6.12
Typical Characteristics ............................................ 8
7
Parameter Measurement Information .................. 9
8
Detailed Description ............................................ 11
8.1
Overview ................................................................. 11
8.2
Functional Block Diagram ....................................... 11
8.3
Feature Description................................................. 11
8.4
Device Functional Modes........................................ 11
9
Application and Implementation ........................ 15
9.1
Application Information............................................ 15
9.2
Typical Application ................................................. 17
10
Power Supply Recommendations ..................... 19
11
Layout................................................................... 19
11.1
Layout Guidelines ................................................. 19
11.2
Layout Example .................................................... 20
11.3
Thermal Considerations ........................................ 21
12
Device and Documentation Support ................. 22
12.1
Device Support...................................................... 22
12.2
Documentation Support ....................................... 22
12.3
Community Resources.......................................... 22
12.4
Trademarks ........................................................... 22
12.5
Electrostatic Discharge Caution ............................ 22
12.6
Glossary ................................................................ 22
13
Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2015) to Revision C
Page
•
Changed pin names for pins 3 and 11 from: IN and Y0 to: IN and Y0. ................................................................................. 3
•
Removed duplicate thermal information line from Layout Guidelines. ................................................................................. 19
Changes from Revision A (July 2008) to Revision B
Page
•
Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1



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