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LSF0108 데이터시트(PDF) 199 Page - Nexperia B.V. All rights reserved

부품명 LSF0108
상세설명  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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제조업체  NEXPERIA [Nexperia B.V. All rights reserved]
홈페이지  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 데이터시트(HTML) 199 Page - Nexperia B.V. All rights reserved

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199
D2PAK (SOT404)
D2PAK (SOT404)
Nexperia
SOT404
plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch;
11 mm x 10 mm x 4.3 mm body
3. Soldering
SOT404
Footprint information for reflow soldering of D2PAK package
sot404_fr
occupied area
solder paste
solder resist (0.05 mm gap from solder land on all directions)
solder lands
Issue date
Dimensions in mm
19-09-10
19-09-11
5.40
8.075
2.15
1.50
0.30
3.00
2.25
4.60
8.35
8.15
7.95
4.85
8.275
16.35
1.55
0.20
1.30
2.54
1.20
0.30
10.50
10.60
1.50
10.85
3.10
1.70
0.20
7.50
7.40
Fig. 2. Reflow soldering footprint for D2PAK (SOT404)
SOT404
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
18 September 2019
3 / 5
Nexperia
SOT404
plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch;
11 mm x 10 mm x 4.3 mm body
3. Soldering
SOT404
Footprint information for reflow soldering of D2PAK package
sot404_fr
occupied area
solder paste
solder resist (0.05 mm gap from solder land on all directions)
solder lands
Issue date
Dimensions in mm
19-09-10
19-09-11
5.40
8.075
2.15
1.50
0.30
3.00
2.25
4.60
8.35
8.15
7.95
4.85
8.275
16.35
1.55
0.20
1.30
2.54
1.20
0.30
10.50
10.60
1.50
10.85
3.10
1.70
0.20
7.50
7.40
Fig. 2. Reflow soldering footprint for D2PAK (SOT404)
SOT404
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
18 September 2019
3 / 5
Nexperia
SOT404
plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch;
11 mm x 10 mm x 4.3 mm body
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT404
sot404_po
06-03-16
13-02-25
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11
1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404
A1
b
0.85
0.60
b2
c
D
D1
E
e
HD
Lp
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
2.9
2.1
0
5 mm
scale
e
e
E
b
D1
HD
D
b2
Q
Lp
c
A1
A
1
3
2
mounting
base
Fig. 1. Package outline D2PAK (SOT404)
SOT404
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
18 September 2019
2 / 5
Nexperia
SOT404
plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch;
11 mm x 10 mm x 4.3 mm body
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT404
sot404_po
06-03-16
13-02-25
Unit
mm
max
nom
min
4.5
4.1
1.40
1.27
1.45
1.05
0.64
0.46
11
1.6
1.2
A
Dimensions (mm are the original dimensions)
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404
A1
b
0.85
0.60
b2
c
D
D1
E
e
HD
Lp
Q
2.54
15.8
14.8
2.6
2.2
10.3
9.7
2.9
2.1
0
5 mm
scale
e
e
E
b
D1
HD
D
b2
Q
Lp
c
A1
A
1
3
2
mounting
base
Fig. 1. Package outline D2PAK (SOT404)
SOT404
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2019. All rights reserved
Package information
18 September 2019
2 / 5
occupied area
solder paste = solder lands
Dimensions in mm
solder resist
0.4
2.1
1.3
0.25
0.25 0.25
1.1
1.2
0.55
0.6
2.3
0.5 (2´)
0.5 (2´) 0.6 (2´)
0.4 (2´)
0.5
1.6
1.7
1.05
DFN2020D-3 (SOT1061D)
0.25
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
14-03-05
14-03-12
0.5 (2x)
0.5 (2x)
0.25
1
0.35 0.35
0.35
1.1
1.2
0.7 (2x)
0.6 (2x)
2.1
1.7
1.3
0.4 (2x)
0.3 (2x)
0.3
0.25
0.3
0.35
1.1
2.3
2.5
0.4
0.5
1.5
1.6
1.7
0.25
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
14-03-05
14-03-12
0.5 (2x)
0.5 (2x)
0.25
1
0.35 0.35
0.35
1.1
1.2
0.7 (2x)
0.6 (2x)
2.1
1.7
1.3
0.4 (2x)
0.3 (2x)
0.3
0.25
0.3
0.35
1.1
2.3
2.5
0.4
0.5
1.5
1.6
1.7
DFN2020D-3 (SOT1061D)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1061D
- - -
sot1061d_po
14-03-11
14-03-12
Unit
mm
max
nom
min
0.65 0.04
2.1
1.9
1.6
1.4
2.1
1.9
1.1
0.9
0.3
0.2
0.45
0.35
0.05
A(1)
Dimensions (mm are the original dimensions)
Note
1. Dimension A is including plating thickness
A1
bp
0.35
0.25
D
D1
E
E1
e
1.3
e1
Lp
v
0.1
y
y1
0.05
0
1
2 mm
scale
pin 1
index area
pin 1
index area
A
B
D
E
bp
A B
v
e
1
2
3
C
y
C
y1
detail X
A
A1
X
D1
e1
Lp
solderable lead
end, protrusion
max. 0.02 mm (3x)
visible depend upon
used manufacturing
technology (6x)
E1
3-pin SMD packages
Minimized outline drawings and reflow soldering footprint
Dimensions in mm
SC-70 (SOT323)
Dimensions in mm
SC-70 (SOT323)
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3´)
0.5
(3´)
0.55
(3´)
1.325
1.85
1.3
3
2
1
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3´)
0.5
(3´)
0.55
(3´)
1.325
1.85
1.3
3
2
1
Dimensions in mm
DFN2020-3 (SOT1061)
09-11-12
Dimensions in mm
0.65
max
2.1
1.9
1.6
1.4
0.35
0.25
0.45
0.35
2.1
1.9
1.1
0.9
0.3
0.2
1.05
0.95
1.3
2
3
1
occupied area
solder paste = solder lands
Dimensions in mm
solder resist
0.4
2.1
1.3
0.25
0.25 0.25
1.1
1.2
0.55
0.6
2.3
0.5 (2´)
0.5 (2´) 0.6 (2´)
0.4 (2´)
0.5
1.6
1.7
1.05
occupied area
solder paste = solder lands
Dimensions in mm
solder resist
0.4
2.1
1.3
0.25
0.25 0.25
1.1
1.2
0.55
0.6
2.3
0.5 (2´)
0.5 (2´) 0.6 (2´)
0.4 (2´)
0.5
1.6
1.7
1.05
DFN2020-3 (SOT1061)
Images are for reference only, for detailed drawings please visit nexperia.com/packages



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