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LSF0108 데이터시트(PDF) 202 Page - Nexperia B.V. All rights reserved

부품명 LSF0108
상세설명  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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제조업체  NEXPERIA [Nexperia B.V. All rights reserved]
홈페이지  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 데이터시트(HTML) 202 Page - Nexperia B.V. All rights reserved

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background image
Nexperia selection guide 2020
202
4-pin SMD packages
Images are for reference only, for detailed drawings please visit nexperia.com/packages
Minimized outline drawings and reflow soldering footprint
SC-73 (SOT223)
SC-73 (SOT223)
1.2
(4´)
1.2
(3´)
1.3
(4´)
1.3
(3´)
6.15
7
3.85
3.6
3.5
0.3
3.9
7.65
2.3
2.3
6.1
4
23
1
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
1.2
(4´)
1.2
(3´)
1.3
(4´)
1.3
(3´)
6.15
7
3.85
3.6
3.5
0.3
3.9
7.65
2.3
2.3
6.1
4
23
1
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
5-pin SMD packages
X2SON5 (SOT1226)
X2SON5 (SOT1226)
LFPAK88 (SOT1235)
LFPAK88 (SOT1235)
NXP Semiconductors
SOT1235
Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads
SOT1235
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved
Package information
13 June 2016
2 / 4
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1235
sot1235_po
16-05-25
16-06-02
Unit
mm
max
nom
min
1.85 0.15
8.4
0.30 0.55 6.45
A
Dimensions (mm are the original dimensions)
LFPAK88: Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads
SOT1235
A1
b
1.275
b2
c
c2
D
θ
D1
E1
e
H
L
L1
6.9
2
4.9
0.9
0.85
8.2
0.40
7.8
L2
1.3
w
0.25 0.10
y
6.7
8.1
7.9
1.65 0.00
7.6
1.125
0.25
A3
1.775
A2
1.625
0.23 0.49 6.15
0°
4.7
E
0.4
0.8
8°
0
8 mm
4
scale
A
θ
E
detail X
C
A3
A1
A
L
C
y
X
mounting
base
c2
A2
c
L2
L1
b
(4x)
D
H
e
1/2 e
w
A
1
2
3
4
b2
E1
D1
Fig. 1. Package outline LFPAK (SOT1235)
b
a
d
e
f
c
b
a
d
e
f
c
1
2
3
4
1
2
3
4
NAME
CHECK
SUPERS. / ECP#
APPR.
MM
UNIT
PROJ.
SCALE
REV
SIZE
SHEET
OF
nexperia
©
DAT
REFLOW SOLDERING
Occupied Area
Solder Resist
Solder Land
Solder Paste
Recommended stencil thickness: 0.125mm
LFPAK56; Power-SO8 (SOT669)
LFPAK56; Power-SO8 (SOT669)
0.6
(3´)
0.7
(4´)
0.25
(2´)
0.25
(2´)
0.6
(4´)
4.2
4.7
0.25
(2´)
1.27
1.1
2
3.81
0.9
(3´)
SP opening =
Cu − 0.050
SR opening =
Cu + 0.075
2.15
2.55
3.45 3.5
3.3
solder lands
solder resist
occupied area
solder paste
125 μm stencil
Dimensions in mm
SOT669
Footprint information for reflow soldering
sot669_fr
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT669
MO-235
06-03-16
11-03-25
02.5
5 mm
scale
e
E1
b
c2
A2
A2
bc
A
e
UNIT
DIMENSIONS (mm are the original dimensions)
mm
1.10
0.95
A3
A1
0.15
0.00
1.20
1.01
0.50
0.35
b2
4.41
3.62
b3
2.2
2.0
b4
0.9
0.7
0.25
0.19
c2
0.30
0.24
4.10
3.80
6.2
5.8
H
1.3
0.8
L2
0.85
0.40
L
1.3
0.8
L1
8ϒ
0ϒ
wy
D(1)
5.0
4.8
E(1)
3.3
3.1
E1(1)
D1(1)
max
0.25
4.20
1.27
0.25 0.1
1
23
4
mounting
base
D1
c
Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads
SOT669
E
b2
b3
b4
H
D
L2
L1
A
A
w M
C
C
X
1/2
e
yC
θ
θ
(A )
3
L
A
A1
detail X
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT669
MO-235
06-03-16
11-03-25
02.5
5 mm
scale
e
E1
b
c2
A2
A2
bc
A
e
UNIT
DIMENSIONS (mm are the original dimensions)
mm
1.10
0.95
A3
A1
0.15
0.00
1.20
1.01
0.50
0.35
b2
4.41
3.62
b3
2.2
2.0
b4
0.9
0.7
0.25
0.19
c2
0.30
0.24
4.10
3.80
6.2
5.8
H
1.3
0.8
L2
0.85
0.40
L
1.3
0.8
L1
8ϒ
0ϒ
wy
D(1)
5.0
4.8
E(1)
3.3
3.1
E1(1)
D1(1)
max
0.25
4.20
1.27
0.25 0.1
1
23
4
mounting
base
D1
c
Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads
SOT669
E
b2
b3
b4
H
D
L2
L1
A
A
w M
C
C
X
1/2
e
yC
θ
θ
(A )
3
L
A
A1
detail X
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.6
(3´)
0.7
(4´)
0.25
(2´)
0.25
(2´)
0.6
(4´)
4.2
4.7
0.25
(2´)
1.27
1.1
2
3.81
0.9
(3´)
SP opening =
Cu − 0.050
SR opening =
Cu + 0.075
2.15
2.55
3.45 3.5
3.3
solder lands
solder resist
occupied area
solder paste
125 μm stencil
Dimensions in mm
SOT669
Footprint information for reflow soldering
sot669_fr
Dimensions in mm



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