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LSF0108 데이터시트(PDF) 201 Page - Nexperia B.V. All rights reserved

부품명 LSF0108
상세설명  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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제조업체  NEXPERIA [Nexperia B.V. All rights reserved]
홈페이지  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 데이터시트(HTML) 201 Page - Nexperia B.V. All rights reserved

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background image
201
X2SON4 (SOT1269-2)
X2SON4 (SOT1269-2)
17-07-01
Dimensions in mm
0.6
0.6
0.32
14
23
SOT1269-2
Footprint information for reflow soldering of SOT1269-2 package
sot1269-2_fr
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
Issue date 17-06-16
17-06-30
0.3
(4×)
0.25
(4×)
0.16
1.08 0.93
0.25
0.225
0.475
1.08
0.33 (4×)0.16
0.28 (4×)
0.93
0.25
0.225
0.475
SOT1269-2
Footprint information for reflow soldering of SOT1269-2 package
sot1269-2_fr
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
Issue date 17-06-16
17-06-30
0.3
(4×)
0.25
(4×)
0.16
1.08 0.93
0.25
0.225
0.475
1.08
0.33 (4×)0.16
0.28 (4×)
0.93
0.25
0.225
0.475
Images are for reference only, for detailed drawings please visit nexperia.com/packages
Dimensions in mm
4-pin SMD packages
LFPAK56E; Power-SO8 (SOT1023)
LFPAK56E; Power-SO8 (SOT1023)
Nexperia
SOT1023
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1023
sot1023_po
13-03-05
17-07-31
Unit
mm
max
nom
min
1.10
0.95
0.15
0.00
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
4.45 5.30
4.95
1.27
0.25 0.1
A
Dimensions
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Plastic single-ended surface-mounted package (LFPAK56E); 4 leads
SOT1023
A1
b
b1
0.85
b2
c
c1
D(1)
4.70
4.45
D1(1) E(1) E1(1)
3.7
3.5
e
H
6.2
5.9
L
1.3
0.8
Lp
0.85
0.40
w
y
8°
0°
θ
0
2.5
5 mm
scale
X
A
c
c1
mounting
base
detail X
A1
Lp
θ
C
C
y
b
b1
A
e
w
A
E
H
D
L
1
2
3
4
E1
D1
b2
(3x)
Fig. 1. Package outline LFPAK56E; Power-SO8 (SOT1023)
SOT1023
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
20 September 2018
2 / 5
Nexperia
SOT1023
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1023
sot1023_po
13-03-05
17-07-31
Unit
mm
max
nom
min
1.10
0.95
0.15
0.00
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
4.45 5.30
4.95
1.27
0.25 0.1
A
Dimensions
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Plastic single-ended surface-mounted package (LFPAK56E); 4 leads
SOT1023
A1
b
b1
0.85
b2
c
c1
D(1)
4.70
4.45
D1(1) E(1) E1(1)
3.7
3.5
e
H
6.2
5.9
L
1.3
0.8
Lp
0.85
0.40
w
y
8°
0°
θ
0
2.5
5 mm
scale
X
A
c
c1
mounting
base
detail X
A1
Lp
θ
C
C
y
b
b1
A
e
w
A
E
H
D
L
1
2
3
4
E1
D1
b2
(3x)
Fig. 1. Package outline LFPAK56E; Power-SO8 (SOT1023)
SOT1023
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
20 September 2018
2 / 5
Nexperia
SOT1023
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
3. Soldering
sot1023_fr
0.6
(3×)
0.7
(4×)
0.25
(2×)
0.25
(2×)
0.6
(4×)
4.2
4.7
0.25
(2×)
1.27
1.1
2
3.81
0.9
(3×)
SP opening =
Cu - 0.050
SR opening =
Cu + 0.075
2.15
2.55
3.45 3.5
3.3
solder lands
solder resist
occupied area
solder paste
125 µm stencil
Fig. 2. Reflow soldering footprint for LFPAK56E; Power-SO8 (SOT1023)
SOT1023
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
20 September 2018
3 / 5
Nexperia
SOT1023
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
3. Soldering
sot1023_fr
0.6
(3×)
0.7
(4×)
0.25
(2×)
0.25
(2×)
0.6
(4×)
4.2
4.7
0.25
(2×)
1.27
1.1
2
3.81
0.9
(3×)
SP opening =
Cu - 0.050
SR opening =
Cu + 0.075
2.15
2.55
3.45 3.5
3.3
solder lands
solder resist
occupied area
solder paste
125 µm stencil
Fig. 2. Reflow soldering footprint for LFPAK56E; Power-SO8 (SOT1023)
SOT1023
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
20 September 2018
3 / 5
LFPAK56-UL2595 (SOT1023A)
LFPAK56-UL2595 (SOT1023A)
Nexperia
SOT1023A
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1023A
- - -
sot1023a_po
17-05-29
17-06-02
Unit
mm
max
nom
min
1.10
0.95
0.15
0.00
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
3.8
3.6
5.30
4.95
1.27
0.25 0.1
A
Dimensions
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Plastic single-ended surface-mounted package (LFPAK56); 4 leads
SOT1023A
A1
0.25
A2
b
b1
0.85
b2
c
c1
D(1)
4.70
4.45
D1(1) E(1) E1(1)
3.7
3.5
e
H
6.2
5.9
L
1.3
0.8
Lp
0.85
0.40
w
y
8°
0°
θ
0
2.5
5 mm
scale
X
c
A
c1
mounting
base
detail X
A1
A2
Lp
θ
C
C
y
b1
A
E
H
D
L (4x)
b
(4x)
(3x)
e
w
A
1
2
3
4
D1
E1
b2
(3x)
Fig. 1. Package outline LFPAK56-UL2595 (SOT1023A)
SOT1023A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
4 May 2018
2 / 5
Nexperia
SOT1023A
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1023A
- - -
sot1023a_po
17-05-29
17-06-02
Unit
mm
max
nom
min
1.10
0.95
0.15
0.00
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
3.8
3.6
5.30
4.95
1.27
0.25 0.1
A
Dimensions
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Plastic single-ended surface-mounted package (LFPAK56); 4 leads
SOT1023A
A1
0.25
A2
b
b1
0.85
b2
c
c1
D(1)
4.70
4.45
D1(1) E(1) E1(1)
3.7
3.5
e
H
6.2
5.9
L
1.3
0.8
Lp
0.85
0.40
w
y
8°
0°
θ
0
2.5
5 mm
scale
X
c
A
c1
mounting
base
detail X
A1
A2
Lp
θ
C
C
y
b1
A
E
H
D
L (4x)
b
(4x)
(3x)
e
w
A
1
2
3
4
D1
E1
b2
(3x)
Fig. 1. Package outline LFPAK56-UL2595 (SOT1023A)
SOT1023A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
4 May 2018
2 / 5
Nexperia
SOT1023A
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
3. Soldering
SOT1023A
Footprint information for reflow soldering of LFPAK56 package
sot1023a_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
17-05-02
17-05-31
0.60
2.15
1.55
0.075
2.00
2.85
3.30
3.45 3.50
0.90
0.25
0.70
1.27
0.075
4.51
0.60
0.25
0.175
0.90
4.20
4.70
5.30
0.60
0.25
0.25
1.05
0.55
7.40
1.15
Fig. 2. Reflow soldering footprint for LFPAK56-UL2595 (SOT1023A)
SOT1023A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
4 May 2018
3 / 5
Nexperia
SOT1023A
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch
3. Soldering
SOT1023A
Footprint information for reflow soldering of LFPAK56 package
sot1023a_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
17-05-02
17-05-31
0.60
2.15
1.55
0.075
2.00
2.85
3.30
3.45 3.50
0.90
0.25
0.70
1.27
0.075
4.51
0.60
0.25
0.175
0.90
4.20
4.70
5.30
0.60
0.25
0.25
1.05
0.55
7.40
1.15
Fig. 2. Reflow soldering footprint for LFPAK56-UL2595 (SOT1023A)
SOT1023A
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
4 May 2018
3 / 5
Minimized outline drawings and reflow soldering footprint
SOT143B
Dimensions in mm
SOT143B
solder lands
solder resist
occupied area
solder paste
sot143b_fr
0.9
0.6
0.7
3.25
3
0.6
(3´)
0.6
(3´)
0.5
(3´)
0.7
(3´)
1
1.9
2
0.75
0.95
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot143b_fr
0.9
0.6
0.7
3.25
3
0.6
(3´)
0.6
(3´)
0.5
(3´)
0.7
(3´)
1
1.9
2
0.75
0.95
Dimensions in mm



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