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LSF0108 데이터시트(PDF) 200 Page - Nexperia B.V. All rights reserved

부품명 LSF0108
상세설명  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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제조업체  NEXPERIA [Nexperia B.V. All rights reserved]
홈페이지  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 데이터시트(HTML) 200 Page - Nexperia B.V. All rights reserved

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Nexperia selection guide 2020
200
3-pin SMD packages
CFP15B (SOT1289B)
CFP15B (SOT1289B)
b
a
d
e
f
c
b
a
d
e
f
c
1
2
3
4
1
2
3
4
NAME
CHECK
SUPERS. / ECP#
APPR.
MM
UNIT
PROJ.
SCALE
REV
SIZE
SHEET
OF
nexperia
©
DAT
REFLOW SOLDERING
Occupied Area
Solder Resist
Solder Land
Solder Paste
Recommended stencil thickness: 0.1mm
b
a
d
e
f
c
b
a
d
e
f
c
1
2
3
4
1
2
3
4
NAME
CHECK
SUPERS. / ECP#
APPR.
MM
UNIT
PROJ.
SCALE
REV
SIZE
SHEET
OF
nexperia
©
DAT
REFLOW SOLDERING
Occupied Area
Solder Resist
Solder Land
Solder Paste
Recommended stencil thickness: 0.1mm
Images are for reference only, for detailed drawings please visit nexperia.com/packages
CFP15 (SOT1289)
CFP15 (SOT1289)
Package outline
© 2010 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not
form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights.
Printed in the Netherlands
www.nxp.com
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1289
sot1289_po
13-07-12
13-08-27
Unit
mm
max
nom
min
5.9
4.4
4.71
1.09
2.05
A
Dimensions (mm are the original dimensions)
Note
1. Dimension A is excluding plating thickness.
CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm
SOT1289
C
D
6.6
D1
E
e
b
b1
4.01
b2
b3
L
3.31
L1
L2
1.2
0.78 0.2
5.8
4.3 2.13 4.61
6.5
0.99
1.95
3.91
3.21
0.25
1.1
5.7
4.2
4.51
6.4
1.19
2.15
4.11
3.41
1.3
0
2.5
5 mm
scale
3
2
1
1
2
3
E
D1
D
C
b3
L1
b1
b2
(2x)
b3
(2x)
L2
(2x)
L
b
A
e
Nexperia
SOT1289
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1289
sot1289_po
14-07-23
14-09-01
Unit
mm
max
nom
min
5.9
4.4
4.8
1.1
2.05
A
Dimensions (mm are the original dimensions)
CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm
SOT1289
C
D
0.82
D1
E
e
b
b1
4.0
b2
b3
L
3.3
L1
L2
1.2
0.78 0.20
0.24
0.16
5.8
4.3 2.13 4.6
6.5
6.4
6.6
0.9
1.95
3.8
3.1
0.25
1.1
5.7
4.2
4.4
0.74
1.3
2.15
4.2
3.5
0.35
0.45
1.3
0
2.5
5 mm
scale
3
2
1
1
2
3
E
D1
D
C
b3
L1
b1
b2
(2x)
b3
(2x)
L2
(2x)
L
b
A
e
Fig. 1. Package outline CFP15 (SOT1289)
SOT1289
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
5 June 2018
2 / 5
Nexperia
SOT1289
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
3. Soldering
Footprint information for reflow soldering of CFP15 package
SOT1289
sot1289_fr
Dimensions in mm
occupied area
solder paste
solder resist
solder lands
Issue date 13-08-28
14-03-12
2.13
1.4 (2×)
1.8 (2×)
1.6 (2×)
4.6
3.73
1.7 (4×)
0.2
2.4
3.8
4
0.11
0.2
0.2
0.4
1.02
0.6
0.05
7.5
0.6
1.9
1.9
5.16 4.96
1.34
1.44
1.64
Fig. 2. Reflow soldering footprint for CFP15 (SOT1289)
SOT1289
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Package information
5 June 2018
3 / 5
Dimensions in mm
SOT89 (SC-62)
SOT89 (SC-62)
solder lands
solder resist
occupied area
solder paste
sot089_fr
1.2
1.9
2
2.25
4.75
1
(3´)
0.7
(3´)
0.6
(3´)
1.1
(2´)
1.2
0.85
0.2
0.5
1.7
4.85
3.95
4.6
1.5
1.5
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot089_fr
1.2
1.9
2
2.25
4.75
1
(3´)
0.7
(3´)
0.6
(3´)
1.1
(2´)
1.2
0.85
0.2
0.5
1.7
4.85
3.95
4.6
1.5
1.5
Dimensions in mm
Minimized outline drawings and reflow soldering footprint
TO-236AB (SOT23)
TO-236AB (SOT23)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3´)
0.6
(3´)
0.6
(3´)
0.7
(3´)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3´)
0.6
(3´)
0.6
(3´)
0.7
(3´)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm



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