OPAX170 datasheet(8/64 Pages) TI2

8 / 64 page

OPA170, OPA2170, OPA4170

SBOS557E – AUGUST 2011 – REVISED APRIL 2018

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Product Folder Links: OPA170 OPA2170 OPA4170

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: OPA170

THERMAL METRIC(1)

OPA170

UNIT

D (SOIC)

DBV (SOT-23)

DRL (SOT)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

149.5

245.8

208.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

97.9

133.9

0.1

°C/W

RθJB

Junction-to-board thermal resistance

87.7

83.6

42.4

°C/W

ψJT

Junction-to-top characterization parameter

35.5

18.2

0.5

°C/W

ψJB

Junction-to-board characterization parameter

89.5

83.1

42.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2170

THERMAL METRIC(1)

OPA2170

UNIT

D (SOIC)

DCU (VSSOP,

micro size)

DGK (VSSOP)

DSG (WSON)

8 PINS

RθJA

Junction-to-ambient thermal resistance

134.3

175.2

180

71.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.1

74.9

89.1

°C/W

RθJB

Junction-to-board thermal resistance

60.6

22.2

130

38.8

°C/W

ψJT

Junction-to-top characterization parameter

18.2

1.6

5.3

3.8

°C/W

ψJB

Junction-to-board characterization parameter

53.8

22.8

120

38.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4170

THERMAL METRIC(1)

OPA4170

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

93.2

106.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.8

24.4

°C/W

RθJB

Junction-to-board thermal resistance

49.4

59.3

°C/W

ψJT

Junction-to-top characterization parameter

13.5

0.6

°C/W

ψJB

Junction-to-board characterization parameter

42.2

54.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

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