L99MH98 datasheet(7/147 Pages) STMICROELECTRONICS

7 / 147 page

2.2

ESD protection

Table 3. ESD protection

Symbol

Parameter

Test

condition

Min Typ Max Unit

Electrostatic discharge test (AEC-Q100-002-E) all pins (HBM)

-2

Electrostatic discharge test (AEC-Q100-002-E) output pins SHx (X =

1...8) and VDH versus GND (HBM)

-4

Charge device model (CDM-AEC-Q100-011) all pins

-500

+500

Charged device model (CDM-AEC-Q100-011) corner pins

-750

+750

2.3

Thermal data

Table 4. Operation junction temperature

Symbol

Parameter

Test condition

Min

Typ

Max

Unit

Operating junction temperature

-40

150

°C

Tstg

Storage temperature

-55

150

°C

All parameters are guaranteed in the temperature range -40 to 150 °C (unless otherwise specified); the device is

still operative and functional at higher temperatures (up to 165 °C).

Note:

•

Parameters limits at higher temperatures than 150 °C may change with respect to what is specified as per

the standard temperature range.

•

Device functionality at high temperature is guaranteed by characterization.

Table 5. Temperature warning and thermal shutdown

Symbol

Parameter

Test condition

Min

Typ

Max

Unit

TjTW_ON

Junction temperature thermal warning threshold

Tj increasing

140

150

160

°C

TjSD_ON

Junction temperature thermal shutdown threshold

Tj increasing

170

180

190

°C

TjSD_OFF

Junction temperature thermal shutdown threshold

Tj decreasing

160

170

180

°C

tfTjTW/TSD

Temperature warning/shutdown filtering time

Tested by scan

µs

Note:

Those parameters are guaranteed at hot only.

2.3.1

VFQFPN-48 Thermal data

Table 6. Packages thermal resistance

Symbol

Parameter

Test condition

Value

Unit

Rthj-amb(1)(2)

Thermal resistance junction to ambient (max.)

°C/W

Rthj-case(3)

Thermal resistance junction to case (max.)

4.5

°C/W

1. The parameter is retrieved according to JEDEC 51.2 referring to thermal testing method in still air.

2. PCB designed according to JEDEC 51.7 referring to high effective thermal conductivity test board.

•

The values quoted are for PCB 129 mm x 60 mm x 1.6 mm ±10%, FR4, 4 layer.

•

Cu thickness on outer layer 0.070 mm, Cu thickness on inner layer 0.035 mm, Thermal vias separation 1.2 mm,

Thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.

•

VFQFPN-48 footprint dimensions are 5.4 mm x 5.4 mm.

L99MH98

Electrical specifications

DS14611 - Rev 3

page 7/147

L99MH98 데이터시트(PDF) 7 Page - STMicroelectronics

L99MH98 데이터시트(HTML) 7 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL