IMXRT1160AXEC datasheet(1/130 Pages) NXP

부품명	IMXRT1160AXEC

상세설명	i.MX RT1160 Crossover Processors Data Sheet for Extended Industrial Products

PDF	130 Pages

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제조업체	NXP [NXP Semiconductors]

홈페이지	http://www.nxp.com

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1160AXEC

Rev. 4, 06/2025

MIMXRT1166XVM5A

MIMXRT1165XVM5A

Package Information

Plastic Package

289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1160 introduction

The i.MX RT1160 is a new high-end processor of the

i.MX RT family, which features NXP’s advanced

implementation of a high performance Arm

Cortex®-M7 core operating at speeds up to 500 MHz

and a power efficient Cortex®-M4 core up to 240 MHz.

The i.MX RT1160 processor has 1 MB on-chip RAM in

total, including a 768 KB RAM which can be flexibly

configured as TCM (512 KB RAM shared with M7 TCM

and 256 KB RAM shared with M4 TCM) or

general-purpose on-chip RAM. The i.MX RT1160

integrates advanced power management module with

DCDC and LDO regulators that reduce complexity of

external power supply and simplifies power sequencing.

The i.MX RT1160 also provides various memory

interfaces, including SDRAM, RAW NAND FLASH,

NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper

RAM/Flash, and a wide range of other interfaces for

connecting peripherals, such as WLAN, Bluetooth™,

i.MX RT1160 Crossover

Processors Data Sheet

for Extended Industrial

Products

1. i.MX RT1160 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

1.3. Package marking information . . . . . . . . . . . . . . . . 9

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. Special signal considerations . . . . . . . . . . . . . . . 20

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 24

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 33

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 44

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 56

4.5. External memory interface . . . . . . . . . . . . . . . . . 61

4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 70

4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 87

4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 105

5.1. Boot mode configuration pins . . . . . . . . . . . . . . 105

5.2. Boot device interface allocation . . . . . . . . . . . . . 105

6. Package information and contact assignments . . . . . . 111

6.1. 14 x 14 mm package information . . . . . . . . . . . 111

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

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