GD32H757VMT7 datasheet(97/151 Pages) GIGADEVICE

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GD32H757xx Datasheet

characteristics(4)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHXTAL(1)

Crystal or ceramic frequency

1.71 V ≤ VDD ≤ 3.6 V

MHz

RF(2)

Feedback resistor

VDD = 3.3 V

—

400

—

CHXTAL(2) (3)

Recommended matching

capacitance on OSCIN and

OSCOUT

—

DutyHXTAL(2)

Crystal or ceramic duty cycle

—

gm(2)

Oscillator transconductance

Startup

—

mA/V

IDD(HXTAL) (1)

Crystal or ceramic operating

current

HXTAL = 25 MHz

—

0.58

—

tST(HXTAL)(1)

Crystal or ceramic startup time

HXTAL = 25 MHz

—

334

—

μs

(1)

Value guaranteed by characterization, not 100% tested in production.

(2)

Value guaranteed by design, not 100% tested in production.

(3)

CHXTAL1 = CHXTAL2 = 2*(CLOAD - CS), For CHXTAL1 and CHXTAL2, it is recommended matching capacitance on OSCIN

and OSCOUT. For CLOAD, it is crystal/ceramic load capacitance, provided by the crystal or ceramic

manufacturer. For CS, it is PCB and MCU pin stray capacitance.

(4)

More details about gm could be found in AN052 GD32 MCU Resonator-Based Clock Circuits.

Table 4-16. High speed external clock characteristics (HXTAL in bypass mode)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHXTAL_ext(1)

External clock source or oscillator

frequency

1.71 V ≤ VDD ≤

3.6 V

—

MHz

VHXTALH(2)

OSCIN input pin high level

voltage

VDD = 3.3 V

0.7 VDD

—

VDD

VHXTALL(2)

OSCIN input pin low level voltage

VSS

—

0.3 VDD

tH/L(HXTAL) (2)

OSCIN high or low time

—

tR/F(HXTAL) (2)

OSCIN rise or fall time

—

DutyHXTAL (2)

Duty cycle

—

(1)

Value guaranteed by characterization, not 100% tested in production.

(2)

Value guaranteed by design, not 100% tested in production.

Table 4-17. Low speed external clock (LXTAL) generated from a crystal/ceramic

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